Quality Assurance-BROCHEER Technology

Commitment to Quality

Quality is what we have always stood for. We insist on genuine products, guarantee the quality of our products, and follow the processes that support us to become a global intelligent service provider.
From supplier management audits, order and delivery order verification, physical comparison, and visual inspection,
BROCHEER always follows established procedures and steps, focusing on every detail to ensure that electronic components are precisely in line with standards.

Items to be inspected

Checking of orders and delivery orders, physical comparison, appearance inspection (bending, oxidation), quantity

Confirmation of RoHS products and other environmental products (when confirming the label)

Inspection records: Yes (stored for 5 years)

Batch inspection record: Yes

Qualified inspector: Only qualified personnel who meet our regulations can conduct inspections. When working, they will wear anti-static clothing, anti-static slippers, and install anti-static wristbands on anti-static pads, and prohibit touching goods with bare hands

Warehouse Management

How to store inventory: The storage location is a normal air-conditioned office in an anti-static room.

Model and storage quantity control: recorded in the inventory management ledger

Expiry management method: In principle, the shelf life is two years.

Operation such as storage of expired products: stored on a special shelf for defective products. When defective products are found, they are recorded in the inventory as ready for disposal, and those found one year later are discarded at the end of the year.

Checking items at the time of shipment: Match the receipt of product name, quantity and packing specification with the actual product.

Shipment inspection

How to check: All products are inspected

Inspection items: Acceptance inspection confirmation, matching the actual product, address confirmation, other confirmation items (if any)

Inspection records: Yes (stored for 5 years)

Packaging materials: use of anti-static bags, vacuum packers, and vacuumizer

Inspection Process

Our quality assurance process embodies the fundamental focus on quality that BROCHEER has built into its inspection system.
Components are inspected, measured, examined and tested from the inside out to ensure that the product meets the customer's standards.

Packaging Inspection

01
File check

02
Image Archiving

03
Label check

04

Visual Inspection

05
Measurement

06
Functional tests

07
Quality inspection completed

08

External Inspection Cooperation

Our quality expectations exceed industry standards, and we actively maintain long-term cooperation with well-known testing organizations in the industry.

China Electronic Components Center Laboratory, referred to as CECC Lab (CECCLab)

China Electronic Component Center Laboratory (CECCLab)

After 15 years of technical accumulation, our service scope covers integrated circuit design, semiconductor post-processing, system-level electronic circuit design, integrated circuit and electronic product testing, and failure analysis. We have set up 2 factories and 4 laboratories in Shenzhen, Hong Kong and Shaanxi, with various instruments and EDA development tools worth hundreds of millions of dollars, and currently employ over 300 people. Our service targets include IC design companies, EMS electronics manufacturers, military and aerospace manufacturers, and global electronic component distributors.

Chip level, system board level failure analysis

Chip chemistry, laser unsealing and capping, chip de-layer analysis, chip cross-section analysis, chip hot spot detection, probe penetration into the chip to measure parameters...

Chip level, system board level failure analysis

Chip chemistry, laser unsealing and decapping, chip delamination analysis, chip cross-section analysis, chip hot spot detection, probe penetration of chip internal measurement parameters, board-level red ink test, slice grinding and sample preparation, high-power microscope and electron microscope observation, Foreign body composition analysis, ray detection, CT non-destructive tomography analysis, ultrasonic scanning analysis.
Electronic components, reliability testing and evaluation

Chip MSL level test and evaluation Chip anti-static ability test and evaluation of electronic components Solderability test Chip, component and whole machine life test Terminal plug-in durability test Drop...

Electronic components, reliability testing and evaluation

Chip MSL level test and evaluation High-accelerated stress test High-accelerated aging test High-pressure, low-pressure and high-altitude environment simulation test component air tightness test Corrosive gas, liquid and salt spray test Wave soldering, reflow process analysis and evaluation.
Physical and material properties testing and analysis

Appearance 3D detection device size, coplanarity measurement material thickness measurement material strength, hardness measurement, pressure resistance, insertion force, push-pull force measurement magnetic permeability...

Physical and material properties testing and analysis

Appearance 3D inspection device size, coplanarity measurement material thickness measurement material strength, hardness measurement, pressure resistance, insertion force, push-pull force measurement magnetic permeability, insulation rate, impedance, inductance, dielectric constant measurement Material quantitative and qualitative detection and analysis Rapid screening and detection of hazardous substances.
IC Test Verification

1. Development of test plan for MPW proofing (chip sample) stage
2. Semiconductor back-end foundry services
3. Incoming IC testing and screening services

IC Test Verification

1. Development of test plan for MPW proofing (chip sample) stage
Provide IC design companies with services such as package design, test board production, test program development and debugging, and assist IC designers to optimize circuits.
2. Semiconductor back-end foundry service
We provide 4-12 inch wafer testing, thinning, cutting, picking, packaging, testing, tape and other post-processing services, Current monthly production capacity: 50K in the middle test, 120KK in cutting, and 140KK in the final test.
3. Incoming IC test screening service
Level 1, authenticity inspection (AIV for short): determine whether the device meets the specified documents or customer-specific requirements;
Level 2, DC characteristic parameter test (DCCT for short): also known as static parameter test;
Level 3, Key Function Testing (KFT): Also known as main function testing, it is a dynamic testing method;
Level 4, full function and characteristic parameter test (FFCT for short): test all functions and parameters of the chip;
Level 5, AC characteristic parameter test (ACCT for short): test and analyze the transient alternating characteristics of the device;
Level 6, Special Environment Testing and Analysis (SEAT): Study the stability of the device working in a special environment.
Testing of electrical characteristics of other electronic comp

1. Parameter testing and comprehensive evaluation of various discrete devices such as resistors, capacitors, inductors, sensors, relays, speakers, and receivers;
2. Test and comprehensive evaluation of various electrical parameters of connectors and wires
3. Each printed circuit board...

Testing of electrical characteristics of other electronic components

1. Parameter testing and comprehensive evaluation of various discrete devices such as resistors, capacitors, inductors, sensors, relays, speakers, and receivers;
2. Test and comprehensive evaluation of various electrical parameters of connectors and wires;
3. Test and comprehensive evaluation of various electrical characteristic parameters of printed circuit boards;
4. Test and comprehensive evaluation of various electrical parameters of DC power supply, batteries and battery chargers, and large-capacity Farad capacitors;
5. Test and comprehensive evaluation of various optoelectronic parameters of LED, LCD screen, touch screen and camera;
6. Test and comprehensive evaluation of various electrical parameters of radio frequency modules and communication modules;
Electromagnetic compatibility and safety testing

Radiation, conducted interference, electromagnetic radiation withstand test, power frequency magnetic field withstand test, current harmonic test, voltage flicker test, voltage transient withstand test, electrical fast pulse withstand test, conduction withstand test, lightning surge Tolerance test.

Electromagnetic compatibility and safety testing

Radiation, conducted interference, electromagnetic radiation withstand test, power frequency magnetic field withstand test, current harmonic test, voltage flicker test, voltage transient withstand test, electrical fast pulse withstand test, conduction withstand test, lightning surge Tolerance test.